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Title:
 
Accelerated Damp Heat Test Combining Current Stressor
 
Author(s):
 
H. Chen, C.H. Hsueh, C. Chen, M. Chang
 
Keywords:
 
Reliability, Accelerated Testing, Damp Heat (DH), PV Module
 
Topic:
 
OPERATIONS, PERFORMANCE AND RELIABILITY OF PHOTOVOLTAICS (FROM CELLS TO SYSTEMS)
Subtopic: PV Modules
Event: 31st European Photovoltaic Solar Energy Conference and Exhibition
Session: 5CV.2.30
 
Pages:
 
2549 - 2553
ISBN: 3-936338-39-6
Paper DOI: 10.4229/EUPVSEC20152015-5CV.2.30
 
Price:
 
 
0,00 EUR
 
Document(s): paper, poster
 

Abstract/Summary:


Damp heat test is one of the crucial qualification test in IEC 61215 standard to evaluate the ability to withstand thermal and humidity penetration. In this paper, by applying with Arrhenius model, the activation energy extracted from extended damp heat for P-multi crystalline silicon PV module is 0.78eV. Furthermore, we simultaneously exert short circuit current (Isc) bias as another stressor to investigate the failure modes and the correlation with temperature and humidity. The acceleration factor for P-multi and P-mono module is 1.48 and 1.46 by applying Isc loading, and it is almost equivalent to that (1.42) of raising temperature from 85°C to 90°C during damp heat. The module with and without electric current bias shows similar failure modes – mainly due to corrosion. We also compared prolonged DH test for bare cell and module by EL, visual inspection and electrical characteristics. The ability of bare cell to withstand the effect of long term penetration of humidity is stronger than we thought. It infers that other material like acetic acid generated by hydrolysis reaction between water vapor and EVA, or finger corrosion induced by flux residual may cause power decay tremendously after damp heat. This corrosion of the electrical interconnects by EVA flux will be also studied in the future work.