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Buckling Test: A Useful Tool for a Mechanical Characterization of Silicon Wafers
M. Ezquer Mayo, E. Zugasti, J.M. Cuadra, M. Murillo, A. Turumbay, I. Gavilanes-Perez, A.R. Lagunas
Silicon Wafer, Buckling, Mechanical Characterization
Wafer-Based Silicon Solar Cells and Materials Technology
Subtopic: Handling Issues and Manufacturing Automation
Event: 23rd European Photovoltaic Solar Energy Conference and Exhibition, 1-5 September 2008, Valencia, Spain
Session: 2DV.1.58
2005 - 2008
ISBN: 3-936338-24-8
Paper DOI: 10.4229/23rdEUPVSEC2008-2DV.1.58
0,00 EUR
Document(s): paper


The purpose of this article is to describe the potential of using experimental Buckling tests to mechanically characterize silicon wafers. With that aim, the final objective is to establish the theoretical limits of maximum bending and stress bearable in order to avoid breakage during wafer manipulation. Specific simulations with finite elements programs have been performed to find a mechanical model able to predict the behavior of silicon wafers submitted to different mechanical conditions. Other experimental tests, as Bending-by-own-weight or 4-line Bending, were also used to match the final model to the reality as accurately as possible. Finally, it is pointed out that the high speed of the Buckling tests can be used to integrate a similar system in the solar cell production line. This method might be an interesting tool to get the wafers, with a high probability of breakage, out of the fabrication line.