Search documents

Browse topics

Document details

Balancing Encapsulation Quality and Robustness of Film Silicon PV Technology for Optimal Durability and Cost
S.H.M. Harkema, J.A.J. Peters, I. Bennett, L. Plomp
Components for PV Systems
Subtopic: PV Modules
Event: 25th European Photovoltaic Solar Energy Conference and Exhibition / 5th World Conference on Photovoltaic Energy Conversion, 6-10 September 2010, Valencia, Spain
Session: 4AV.3.3
3964 - 3967
ISBN: 3-936338-26-4
Paper DOI: 10.4229/25thEUPVSEC2010-4AV.3.3
0,00 EUR
Document(s): paper


ECN develops thin-film silicon PV technology that can be produced roll to roll, with the objective to reduce costs per Wp. The production process as well as integration of the resulting PV-film in building products, requires flexible (front-side) encapsulation. This in turn relies on polymer materials with relatively high costs and water ingress. Defining the demands of an encapsulation system is not obvious and depends on the intrinsic properties of the PV materials. To obtain an optimum in durability and cost, a proper balance between encapsulation quality and PV materials robustness is essential. Our work concentrates on both understanding the chemical and thermo-mechanical deterioration mechanisms of the considered PV materials and development of fit-to-purpose encapsulation technology. We evaluated the influence of robustness parameters of our f-Si technology under exposure of humidity and condensed water at elevated temperatures. Condensation of water showed major effects on the stability of the (encapsulated) layered structures. It caused local delamination (buckling) which is attributed to the compressive stresses in the silicon layer and a decrease in adhesion at the various interfaces. Various adjustments in e.g. active layer microstructure, types of back contact layer material, and pretreatment of substrates, showed significant improvements in the stability of the f-Si technology under the test conditions.