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Differences of Rear-Contact Area Formation between Laser Ablation and Etching Paste for PERC Solar Cells
M. Bähr, G. Heinrich, O. Doll, I. Köhler, C. Maier, A. Lawerenz
Laser Processing, Metallization, Metallisation, PERC Solar Cells
Wafer-based Silicon Solar Cells and Materials Technology
Subtopic: Silicon Solar Cell Improvements
Event: 26th European Photovoltaic Solar Energy Conference and Exhibition
Session: 2EO.2.3
1203 - 1209
ISBN: 3-936338-27-2
Paper DOI: 10.4229/26thEUPVSEC2011-2EO.2.3
0,00 EUR
Document(s): paper


Key parameters in the manufacturing of the rear metallization for PERC solar cells are the thermal budget within the firing process, the materials used, e.g. metallization paste, and the geometry of the rear-side openings. As a further key parameter, the way of opening the dielectric passivation layers is investigated. Three different methods for locally removing a dielectric layer were analyzed, including one approach by laser processing (using laser irradiation in a short and ultrashort pulse length regime) and an other one by screen printing an etching paste. After locally removing the passivation stack, the rear-side metallization was carried out by application of different Al pastes and firing profiles. From SEM pictures and comparisons of the width of the local openings after structuring and after firing, different general statements were deduced as about the influence of the structuring width, the influence of the firing profile or the relation of the method of structuring with the formation of the contact area.