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Fine Line Printing of Front Side Metallisations Using Ultra Fine Mesh and Stencil Technologies
T. Falcon, R. Anderson, D.A. Clark
Busbar(s), Stencil, Ultra-Fine Line, Mesh, Paste Consumption
Wafer-Based Silicon Solar Cells and Materials Technology
Subtopic: Silicon Solar Cell Improvements
Event: 27th European Photovoltaic Solar Energy Conference and Exhibition
Session: 2CV.5.39
1739 - 1743
ISBN: 3-936338-28-0
Paper DOI: 10.4229/27thEUPVSEC2012-2CV.5.39
0,00 EUR
Document(s): paper


Front side metallisations were printed to achieve ultra fine line widths using two approaches. Ultra fine line mesh screens were used in single print mode to achieve finger widths down to 40μm. High precision stencils were used to acheive finger widths down to 30μm in dual print mode where a 2nd conventional mesh print was used to print the busbar in order to determine effect on cell conversion efficiency and paste consumption. The paste consumption, line aspect ratio and cell IV data are analysed for each option tested. In addition, data on the solder adhesion of the busbar is presented. Use of ultra fine meshes in single print mode is shown to enable reductions in paste consumption up to 30% without effecting cell efficiency. In this mode the busbar thickness is significantly reduced causing a reduction in solder adhesion forces. In dual print mode the use of a stencil to print the fingers and a 400 mesh to print a dedicated busbar paste is shown to achieve total laydown reductions up to 40% and a relative increase in efficiency > 0.5% . Use of a dedicated busbar paste enables high solder adhesion forces to be maintained.