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Title:
 
High Efficiency with Almost No Metallisation: Multiple Busbar Wire Interconnection of Plated Solar Cells
 
Author(s):
 
M. Edwards, R. Evans, T. Söderström, A. Sugianto, L. Koschier, S.R. Wenham
 
Keywords:
 
Cost Reduction, Module Manufacturing, Interconnection, Devices, Metallization, Metallisation
 
Topic:
 
WAFER-BASED SILICON SOLAR CELLS AND MATERIALS TECHNOLOGY
Subtopic: Silicon Solar Cell Improvements
Event: 28th European Photovoltaic Solar Energy Conference and Exhibition
Session: 2DV.4.44
 
Pages:
 
2097 - 2102
ISBN: 3-936338-33-7
Paper DOI: 10.4229/28thEUPVSEC2013-2DV.4.44
 
Price:
 
 
0,00 EUR
 
Document(s): paper, poster
 

Abstract/Summary:


Perpendicular multiple busbar wires can be an effective way of interconnecting standard screen printed solar cells with low resistive loss. The technology is also an effective way to interconnect plated solar cells, where conventional soldered interconnects may be problematic. However, the full benefits of this interconnection technology can be fully realized on plated cell structures with drastically reduced plated metallisation volume. This paper presents a new selective emitter plated cell structure with metallisation reduced to around 1 μm thickness, interconnected using Meyer Burger’s Smartwire perpendicular multiple busbar wire technique. Metal usage on the cell is reduced by more than 90% compared to conventional plated or screen print cells and the use of Ag and Cu on the front surface eliminated or drastically reduced, while high efficiency at the module level is achieved along with environmental durability. Modelling is used to determine the potential benefits of multiple busbar interconnection compared to conventional ribbon tabbing and soldering, and to show that further performance benefits are possible with some cell process adjustments.