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Investigation of Failure Modes, Mechanisms and Driving Forces for Electrically Conductive Adhesives as Interconnects in PV Modules
N. Bosco, M. Springer
Photovoltaic Modules and BoS Components
Subtopic: PV Module Design, Manufacture, Performance and Reliability
Event: 37th European Photovoltaic Solar Energy Conference and Exhibition
Session: 4CO.1.2
845 - 847
ISBN: 3-936338-73-6
Paper DOI: 10.4229/EUPVSEC20202020-4CO.1.2
0,00 EUR
Document(s): paper


In this work we describe our current progress into investigating the reliability of ECA interconnects for PV modules. Preliminary thermal cycling experiments demonstrated that both cohesive and adhesive failure of the ECA joint are relevant failure modes that result in an increase of the joints electrical resistance. A thorough viscoelastic characterization of the candidate ECA was conducted to enable accurate numerical modeling of the joint’s response to thermal cycling. Combined with critical and subcritical fracture measurements, the numerical model elucidates that an additional fatigue mechanism exists which can result in fracture well below subcritical debonding threshold values. It is also demonstrated that fracture of the ECA is more sensitive to humidity than temperature and subcritical debonding mechanisms do exist which are again more sensitive to humidity.