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Title:
 
Kerf-Less Wafering Using Polymer Split Method for Photovoltaic Solar Cells and Modules
 
Author(s):
 
S. Schoenfelder, F. Kaule, S. Schindler, R. Lantzsch, K. Petter, C. Beyer, J. Richter
 
Topic:
 
Silicon Photovoltaics
Subtopic: Feedstock, Crystallisation, Wafering, Defect Engineering
Event: 33rd European Photovoltaic Solar Energy Conference and Exhibition
Session: 2BO.3.2
ISBN: 3-936338-47-7
 
Price:
 
 
0,00 EUR
 
Document(s): presentation
 

Abstract/Summary:


Kerf-less wafering technologies are constantly developed mainly in order to reduce costs in the crystalline solar manufacturing process. An analysis of new kerf-less concepts should include their consequences on the following process steps. In this work, the new kerf-less technology Polymer Split, based on a well-known mechanical cleavage principle, is used to produce split wafers and use them for solar cell and module production. Although the results show the potential of such technologies, they also show drawbacks, e.g. the optical appearance of the solar cells, which was improved by an alternative cleaning process. This work will show an analysis of the Polymer Split wafers, solar cells and modules made therof.