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Low Temperature Lead Free Solder Pastes for Shingling Interconnection
N.S. Pujari, P.M. Krithika, P. Vishwanath, S. Sarkar, C. Bilgrien
Interconnection, Solder Joints, Shingling, Solder Paste
New Materials and Concepts for Photovoltaic Devices
Subtopic: New Materials and Concepts for Cells and Modules
Event: 37th European Photovoltaic Solar Energy Conference and Exhibition
Session: 1AO.3.2
29 - 32
ISBN: 3-936338-73-6
Paper DOI: 10.4229/EUPVSEC20202020-1AO.3.2
0,00 EUR
Document(s): paper


We present solder paste as an alternative interconnection material for shingling assembly. Two tin-bismuth based lead free low temperature solder pastes with one eutectic and other non eutectic alloy were studied. These pastes were evaluated for printing, stability, and rapid reflowing properties to make them suitable for existing automated shingling machines. We found that solder paste based assemblies yield reliable interconnection joints with uniform intermetallic compound (IMC) formation and no loss of power output. The modules pass thermal-cycling and damp heat reliability testing according to IEC 61215 and static mechancal load test as per IEC 61215-2:2016 Clause 4.16.