Title:	Low Temperature Solar Cell Encapsulation with Novel Silicone Elastomer for Building Integrated PV
Author(s):	G. Beaucarne, M. Zelba, E. Jadot, J. Curon, F. Gubbels, V. Hayez, B. Sanabria Arenas, G. Chambard, R. Karoblis
Keywords:	Encapsulation, Silicon, Building Integrated PV (BIPV)
Topic:	Photovoltaic Modules and BoS Components
Subtopic:	Materials for PV Modules, Durability, Reliability and Accelerated Testing Methods
Event:	8th World Conference on Photovoltaic Energy Conversion
Session:	3DV.3.13
Pages:	893 - 897
ISBN:	3-936338-86-8
Paper DOI:	10.4229/WCPEC-82022-3DV.3.13
Price:	0,00 EUR
Document(s):	paper, poster

Abstract/Summary:

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In this paper we introduce a new silicone solar cell encapsulant technology based on a two-part condensation cure chemistry, and implement with it an encapsulation process involving a dam and fill approach and in-lamination sealing. Bubble-free laminates have been fabricated both in a laboratory laminator and in a large area plate laminator. In order to achieve a transparent edge with water vapor barrier properties, a double edge materials procedure is introduced, where a transparent PIB is used as dam material, and a clear moisture cure sealant is backfilled into the groove between the glass plates and the transparent PIB. This technology is anticipated to be highly suited to BIPV applications, where module durability, hotspot resilience and better fire resistance are critical.