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Title:
 
Metal Wrap through Silicon Heterojunction Solar Cells and First Made Minimodules
 
Author(s):
 
Y. Wu, B.B. Van Aken, G. Janssen, J. Löffler, F. Li, Y. Shen, W. Yang, J. Shi, G. Li, Z. Hu, J. Xiong, G. Coletti
 
Keywords:
 
Heterojunction, Silicon (Si), Photovoltaic Cells
 
Topic:
 
WAFER-BASED SILICON SOLAR CELLS AND MATERIALS TECHNOLOGY
Subtopic: Silicon Solar Cell Improvements
Event: 29th European Photovoltaic Solar Energy Conference and Exhibition
Session: 2BO.4.3
 
Pages:
 
475 - 480
ISBN: 3-936338-34-5
Paper DOI: 10.4229/EUPVSEC20142014-2BO.4.3
 
Price:
 
 
0,00 EUR
 
Document(s): paper
 

Abstract/Summary:


In this paper we present the successful integration of a silicon heterojunction (HJ) solar cell with metal wrap through architecture (MWT) and foil based- back contact module technology. With this contribution we show a record cell efficiency of 20.3% achieved using commercial n-type Cz 6 inch wafers and demonstrate an encapsulated cell efficiency of 19.6% achieved on a 2×2 mini-module. To our knowledge this is the first time that module results of MWT-HJ architecture have been reported. In this studies , we propose a method to increase the solar cell performance up to 21% together with a 50% cost of ownership reduction of the front silver metal including via and conductive adhesive. This is possible solely by the optimization of the front metal grid. MWT-HJ is a fully low-temperature integrated cell and module concept compatible also with thinner wafers.