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Title:
 
Quantifying the Solderability of Lead Free Solder Alloys on Solar Cells Using Wetting Balance Analyzer
 
Author(s):
 
J. Wendt, M. Köhler, M. Träger
 
Keywords:
 
Module, Soldering, Characterisation, Characterization
 
Topic:
 
Components for PV Systems
Subtopic: PV Modules
Event: 26th European Photovoltaic Solar Energy Conference and Exhibition
Session: 4AV.1.2
 
Pages:
 
3298 - 3301
ISBN: 3-936338-27-2
Paper DOI: 10.4229/26thEUPVSEC2011-4AV.1.2
 
Price:
 
 
0,00 EUR
 
Document(s): paper
 

Abstract/Summary:


Solderability is a major aspect to be considered in module manufacturing. To understand the effects governing the soldering process it is necessary to understand the solderability as a system. It is composed of the suitability of the materials, the feasibility of the process and the reliability of the interconnection. For determining the suitability of involved materials, we recommend using a wetting balance analyzer. In the first part of the paper, we show how the analyzer works. We explain the experimental setup and which boundary conditions affect the results. The size of the test samples should be defined and identical. The number of measurements with one piece of solder should not be too large. Generously fluxing both cell and solder is very important to achieve trustable results. An exemplary series of measurements is given to explain how to handle them. To prove the suitability of the system, we show the differences in wetting of three different alloys. A standard SnPbAg and two lead free alloys: SnAgCu and SnBi. Additionally we show how different kinds of flux influence the wetting behaviour of SnAgCu alloy.