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Reliability of the Industrial Shingling Module by ECA Characteristics
J.-W. Baik, C.-S. Park, S.-H. Gong, Y.-J. Kim, J.-Y. Lim, J.-W. Kang, Y. Min, K.K Hong, E.-J. Lee, S.-O. Choi, D.-S. Kim
Photovoltaic Modules and BoS Components
Subtopic: PV Module Design, Manufacture, Performance and Reliability
Event: 37th European Photovoltaic Solar Energy Conference and Exhibition
Session: 4AV.2.10
ISBN: 3-936338-73-6
0,00 EUR
Document(s): poster


A shingling module is rising to an attractive item due to increasing a demand of high power and black look module using shingling cell packaging technics in the PV industry these day. The shingling module is made by shingling the strips which were cut by laser scribing with Electrical conductive adhesives (ECA) paste without tabbing process. In the shingling process, the module passes through the two heating process, curing and lamination. Curing is short process at high temperature under 150. But, the lamination is a long time process at the high temperature. This thermal budget inevitably affects to ECA reliability in shingled modules. So, this ECA is one of the most important materials because it was consist of silver power and conductive organic materials which will be weakened by heating process. Therefore, it has to be studied for reliability of shingling module. But, this issue has not been studied for the mass production. In this study, we focused on the reliability of industrial shingling modules according to ECA characteristic. We make the mini modules using different ECA various Ag contents to investigate how to affect on ECA reliability after lamination. In addition, we set the different lamination conditions varying the time and temperature to find the parameters which strongly affect to ECA reliability. For checking the effect of a thermal budget due to lamination, we measure a gel content according to lamination conditions after lamination. For reliability analysis of shingling module, we experiment a thermal cycle (TC) testing for the samples followed by measuring an EL image to study ECA stability during thermal cycle(cycle 0 to cycle 400).