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Stable Copper Plated Metallization on SHJ Solar Cells & Investigation of Selective Al/AlOx Laser Patterning
T. Hatt, J. Bartsch, S. Schellinger, J. Schneider, A.A. Brand, S. Kluska, M. Glatthaar
Laser Processing, Inkjet Printing, Copper, Silicon Heterojuction Solar Cells, Electroplating, Metallization
Silicon Materials and Cells
Subtopic: Low Temperature Route for Si Cells
Event: 38th European Photovoltaic Solar Energy Conference and Exhibition
Session: 2DV.3.27
326 - 329
ISBN: 3-936338-78-7
Paper DOI: 10.4229/EUPVSEC20212021-2DV.3.27
0,00 EUR
Document(s): paper


Copper plating metallization is growing in importance to replace silver and to enable growth of photovoltaic to terawatt-scale. Besides better performance of the plated Cu contacts on solar cells, the processing needs to be less complex and more cost effective. The „NOBLE“ metallization responds to cost savings for bifacial silicon heterojunction solar cells. This study shows that the processing with inkjet-printing for patterning of the top Al masking layer is yet mature enough for first tests on industrial pilot. Efficiencies comparable to the Ag screen-printed reference on the same precursors grade are reached. To even improve the patterning throughput a selective laser ablation patterning of the Al/AlOx layer is further investigated. There, laser-induced damaging is avoided by choosing adapted laser settings and first large area SHJ solar cells are manufactured with this method yielding an encouraging 21.4% efficiency.