Title:	Shingle Interconnection on HJT Solar Cells: Reliability Study and Upscaling for High Power PV Modules
Author(s):	C. Carrière, V. Barth, S. Harrison, A. Bettinelli, E. Voroshazi, L. Cerasti, M. Galiazzo, S. Wendlandt, A. Derrier
Topic:	Photovoltaic Modules and BoS Components
Subtopic:	PV Module Design, Manufacture, Performance and Reliability
Event:	38th European Photovoltaic Solar Energy Conference and Exhibition
Session:	4AV.1.15
ISBN:	3-936338-78-7
Price:	0,00 EUR
Document(s):	poster

Abstract/Summary:

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Shingle interconnection has become now part of the advanced module technologies that enable major market players to offer new products with ever-increasing performance, easily adaptable to market developments in terms of wafer size and manufacturing processes. The increased commercialisation of shingled cells modules demonstrates confidence in such products, not only for their high efficiency and reliability [1-2], but also for their highly aesthetic appearance, making them a good candidate for the deployment of photovoltaic parts in the automotive (VIPV) and building industries (BA/BIPV). The most common solar cell technology used in shingle modules is mainly PERC cell technology followed closely by standard Al-BSF cell technology. The highly promising solar cell heterojunction technology (HJT) market share being widely expanding according to the ITRPV [3], further cells and modules evolutions are necessary. As part of the European Highlite project, the development to upper maturity level of the shingle interconnection technology applied to the HJT solar cells technology is one of the key objectives.