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The Influence of Surface Quality on Diamond Wire Sawn Multi-Crystalline Silicon Wafer
T.-Y. Wang, J.-C. Hsiao, C.-Y. Cheng, J.-Y. Liu, W.-H. Lin, P.-C. Yu
Etching, Multicrystalline Silicon, Diamond Wire Saw
Wafer-Based Silicon Solar Cells and Materials Technology
Subtopic: Silicon Feedstock, Crystallisation and Wafering
Event: 32nd European Photovoltaic Solar Energy Conference and Exhibition
Session: 2BO.2.4
307 - 309
ISBN: 3-936338-41-8
Paper DOI: 10.4229/EUPVSEC20162016-2BO.2.4
0,00 EUR
Document(s): paper


Diamond wire-saw is widely using in single-crystalline silicon wafer slicing process. The vantages of diamond wire technology are low cost and high production speed. However, the diamond-wire saw is not applied on multi-crystalline wafer slicing process. The reason is the saw mark on the surface of multi-crystalline wafer caused by slicing will affect the texturing process. Therefore, a surface treatment for the diamond wire sawn multicrystalline wafer is necessary. In this study, the grinding and sandblasting process was used for surface treatment of diamond wire sawn multi-crystalline wafer. The wafer quality and the solar cell efficiency were used to evaluate the effect of surface treatment process. The experimental results reveal significantly improved the energy conversion efficiency. With surface treatment process, the saw mark on the wafer surface could be removed. The reforming surface can have better texturing structure and enhance the solar cell characteristics. The energy conversion efficiency is 18.4% with surface treatment, which is comparable with the slurry sawn solar cell (18.3%). The cost of the surface treatment is lower than the traditional slurry wire technology.