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Title:
 
Reliability of Low Temperature Conductive Film Interconnection Process for PV Modules
 
Author(s):
 
S. Zhang, Y. Xie, H. Jiao, J. Xu, Z. Feng, P.J. Verlinden
 
Keywords:
 
Contact Resistance, Low Temperature, Interconnection, Conductive Film
 
Topic:
 
Operation, Performance, Reliability and Sustainability of Photovoltaics
Subtopic: PV Cells and Modules
Event: 32nd European Photovoltaic Solar Energy Conference and Exhibition
Session: 5CO.13.4
 
Pages:
 
1598 - 1602
ISBN: 3-936338-41-8
Paper DOI: 10.4229/EUPVSEC20162016-5CO.13.4
 
Price:
 
 
0,00 EUR
 
Document(s): paper
 

Abstract/Summary:


A detailed investigation of the reliability of PV modules using a low-temperature conductive film interconnection process is presented. An advanced low-temperature conductive film bonding technology is compared to the conventional soldering process. The reliability of PV modules with different interconnection processes is analyzed by up to two times the standard module reliability testing sequences. At the material level, the stability of the contact resistance is analyzed under different temperatures. The results show that, compared to the conventional soldering process, the low-temperature conductive film bonding technology exhibits a comparable reliability, benefiting from low stress thanks to a low-temperature process. This analysis demonstrates the potential for long durability of the cross-linked conductive film. Besides, low temperature interconnection technology may be combined with other advanced technologies to achieve higher module power.