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Title:
 
Mechanical and Microstructural Analysis of Diamond Wire Sawn Wafers Considering the Wire Wear in Sawing Process
 
Author(s):
 
R. Köpge, C. Klute, F. Kaule, K. Sunder, O. Anspach, S. Schoenfelder
 
Topic:
 
WAFER-BASED SILICON SOLAR CELLS AND MATERIALS TECHNOLOGY
Subtopic: Silicon Feedstock, Crystallisation and Wafering
Event: 31st European Photovoltaic Solar Energy Conference and Exhibition
Session: 2AV.1.35
ISBN: 3-936338-39-6
 
Price:
 
 
0,00 EUR
 
Document(s): poster
 

Abstract/Summary:


In order to use diamond wire sawing as an economic wafering technology, the wafers have to obtain mechanical quality standards. Therefore the diamond sawing process has to be optimized regarding the mechanical yield and wafer strength. In this work the influence of the wafering parameter stroke length on wafer strength is investigated. By moving of the sawing wire (forwards and backwards) during the sawing process in the silicon brick appear different contact lengths (silicon contact length) between the silicon material and the diamond wire that is equal to different stages of wire wear. The investigations show that this silicon contact length, as wafering parameter, leads to a decrease of wafer strength with increasing contact length and wire wear. The correlation between the morphology of subsurface damages and the fracture strength of the wafers is investigated.