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Title:
 
Increased ION Energies for Texturing in a High-Throughput Plasma Tool
 
Author(s):
 
P. Piechulla, J. Seiffe, M. Hofmann, J. Rentsch, R. Preu
 
Keywords:
 
Lifetime, Dry Etching, Crystal Orientation, Plasma Texturing, Inline Processing
 
Topic:
 
Wafer-based Silicon Solar Cells and Materials Technology
Subtopic: Manufacturing Issues and Processing
Event: 26th European Photovoltaic Solar Energy Conference and Exhibition
Session: 2CV.2.16
 
Pages:
 
2024 - 2027
ISBN: 3-936338-27-2
Paper DOI: 10.4229/26thEUPVSEC2011-2CV.2.16
 
Price:
 
 
0,00 EUR
 
Document(s): paper
 

Abstract/Summary:


Plasma texturing is a promising alternative to wet chemical texturing of solar cells. Processes using increased ion energies have previously been shown to be advantageous on single wafer tools. In this work, the microwave plasma of an inline tool is enhanced by a radiofrequency field, which leads to a DC self bias and thus increased ion energies. A high-throughput process suitable for monocrystalline cells has been developed and characterized by weighted reflection and excess carrier lifetime on float zone material. Additionally, experiments on shiny etched wafers with <111> and <100> orientation have been shown to be a promising approach to finding parameters for etching independent of crystal orientation.