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Increased ION Energies for Texturing in a High-Throughput Plasma Tool
P. Piechulla, J. Seiffe, M. Hofmann, J. Rentsch, R. Preu
Lifetime, Dry Etching, Crystal Orientation, Plasma Texturing, Inline Processing
Wafer-based Silicon Solar Cells and Materials Technology
Subtopic: Manufacturing Issues and Processing
Event: 26th European Photovoltaic Solar Energy Conference and Exhibition
Session: 2CV.2.16
2024 - 2027
ISBN: 3-936338-27-2
Paper DOI: 10.4229/26thEUPVSEC2011-2CV.2.16
0,00 EUR
Document(s): paper


Plasma texturing is a promising alternative to wet chemical texturing of solar cells. Processes using increased ion energies have previously been shown to be advantageous on single wafer tools. In this work, the microwave plasma of an inline tool is enhanced by a radiofrequency field, which leads to a DC self bias and thus increased ion energies. A high-throughput process suitable for monocrystalline cells has been developed and characterized by weighted reflection and excess carrier lifetime on float zone material. Additionally, experiments on shiny etched wafers with <111> and <100> orientation have been shown to be a promising approach to finding parameters for etching independent of crystal orientation.