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Title:
 
IntegRex - Process Development of a Module Interconnection Concept for Thin Crystalline Silicon Films
 
Author(s):
 
R. Pavlovic, S. Lindekugel, S. Janz, S. Reber
 
Keywords:
 
Crystalline Silicon, Thin Film (TF), Monolithic Interconnection
 
Topic:
 
THIN FILM SOLAR CELLS
Subtopic: Silicon-based Thin Film Solar Cells
Event: 28th European Photovoltaic Solar Energy Conference and Exhibition
Session: 3DV.1.8
 
Pages:
 
2630 - 2633
ISBN: 3-936338-33-7
Paper DOI: 10.4229/28thEUPVSEC2013-3DV.1.8
 
Price:
 
 
0,00 EUR
 
Document(s): paper, poster
 

Abstract/Summary:


In this work the realization of a concept for integrated interconnected crystalline silicon thin film solar cells in a laboratory process is described. This module concept, referred to as IntegRex (Integrated interconnection of recrystallized silicon layers), is developed for recrystallized or lift-off crystalline silicon layers. Following the classical thin film approach the crystalline silicon thin film is divided into individual cell strips and interconnected monolithically on a substrate. To investigate the individual processing steps silicon on insulator (SOI) wafers with a buried oxide layer and epitaxially deposited back surface field (BSF) and base are used instead of recrystallized or lift-off crystalline silicon films. A first batch of IntegRex mini-modules on SOI wafers was processed. Despite a not yet optimized metallization scheme, a VOC of over 3 V could be reached for a mini-module consisting of five cells. Problems that occurred in the metallization process are presented here and a possible solution is discussed.