Title:	IntegRex - Process Development of a Module Interconnection Concept for Thin Crystalline Silicon Films
Author(s):	R. Pavlovic, S. Lindekugel, S. Janz, S. Reber
Keywords:	Crystalline Silicon, Thin Film (TF), Monolithic Interconnection
Topic:	THIN FILM SOLAR CELLS
Subtopic:	Silicon-based Thin Film Solar Cells
Event:	28th European Photovoltaic Solar Energy Conference and Exhibition
Session:	3DV.1.8
Pages:	2630 - 2633
ISBN:	3-936338-33-7
Paper DOI:	10.4229/28thEUPVSEC2013-3DV.1.8
Price:	0,00 EUR
Document(s):	paper, poster

Abstract/Summary:

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In this work the realization of a concept for integrated interconnected crystalline silicon thin film solar cells in a laboratory process is described. This module concept, referred to as IntegRex (Integrated interconnection of recrystallized silicon layers), is developed for recrystallized or lift-off crystalline silicon layers. Following the classical thin film approach the crystalline silicon thin film is divided into individual cell strips and interconnected monolithically on a substrate. To investigate the individual processing steps silicon on insulator (SOI) wafers with a buried oxide layer and epitaxially deposited back surface field (BSF) and base are used instead of recrystallized or lift-off crystalline silicon films. A first batch of IntegRex mini-modules on SOI wafers was processed. Despite a not yet optimized metallization scheme, a VOC of over 3 V could be reached for a mini-module consisting of five cells. Problems that occurred in the metallization process are presented here and a possible solution is discussed.