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Title:
 
Development of a Metallization Process for a Super Fine Line Printing
 
Author(s):
 
A. Voltan, W. Tao, D. Tonini, M. Zamuner, M. Martire, O. Borsato, E. Bortoletto, C. Bottosso, X. Wang, Q. Chang, Y. Wang, M. Galiazzo
 
Keywords:
 
c-Si, Screen Printing, Metallization, Metallisation
 
Topic:
 
WAFER-BASED SILICON SOLAR CELLS AND MATERIALS TECHNOLOGY
Subtopic: Silicon Solar Cell Improvements
Event: 28th European Photovoltaic Solar Energy Conference and Exhibition
Session: 2DV.3.20
 
Pages:
 
1890 - 1893
ISBN: 3-936338-33-7
Paper DOI: 10.4229/28thEUPVSEC2013-2DV.3.20
 
Price:
 
 
0,00 EUR
 
Document(s): paper
 

Abstract/Summary:


In this paper we present the latest Double Printing results achieved at laboratory scale and in production at Tianjin Yingli using Esatto Technology™. With continual process and equipment optimization it is now possible to perform Double Printing consistently at 50μm finger width with >30k screen lifetime and >0.2% efficiency gain versus Single Printing, with >0.4% process yield benefit and 20mg paste saving. Moreover, lab experiments with new paste generations and reduced screen openings enable Double Printing metallization with 40μm finger width, >0.2% efficiency gain and 10mg paste saving.