login

Search documents

Browse topics

Document details

 
Title:
 
Optimization of Multi-Layer Metallization Design for Large-Area Back-Contact Back-Junction Solar Cells
 
Author(s):
 
M. Hendrichs, R. Keding, A. Spribille, T. Fellmeth, S. Nold, F. Clement, A. Wolf, D. Biro
 
Keywords:
 
Back Contact, Cost Reduction, Solar Cell, Modelling / Modeling, Metallization, Metallisation
 
Topic:
 
WAFER-BASED SILICON SOLAR CELLS AND MATERIALS TECHNOLOGY
Subtopic: Silicon Solar Cell Characterisation and Modelling
Event: 29th European Photovoltaic Solar Energy Conference and Exhibition
Session: 2BO.2.2
 
Pages:
 
412 - 416
ISBN: 3-936338-34-5
Paper DOI: 10.4229/EUPVSEC20142014-2BO.2.2
 
Price:
 
 
0,00 EUR
 
Document(s): paper
 

Abstract/Summary:


In this study, a multi-layer metallization concept for high-efficient large-area silicon back-contact back-junction solar cells is investigated. The metallization approach represents an industrial alternative to the well-known edge-to-edge cell interconnection technology, allowing for a decoupling of the cell metallization from the external contact structure by inserting an intermediate insulation layer. A first proof of principle is shown for an n type back-contact back-junction solar cell with an edge length of 156 mm and evaporated aluminum grid fingers. Furthermore, we present a tool that allows for the design optimization of the contact layout by combining detailed cost of ownership calculations with analytical solar cell simulations. Two back-end process sequences are compared and for both approaches the most cost-effective metallization layout is determined on cell level. Finally, a sensitivity analysis is carried out, revealing the high potential of the investigated back-contact back junction solar cell structures.