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Title:
 
Gripping-in-Liquid: Significant Parameters for the Automated Handling of Ultrathin Substrates in Cleaning Baths
 
Author(s):
 
T. Giesen, P. Mayer, C. Behtan, R. Wertz
 
Keywords:
 
Crystalline, Manufacturing and Processing, Cleaning, Substrate/s, Liquid
 
Topic:
 
WAFER-BASED SILICON SOLAR CELLS AND MATERIALS TECHNOLOGY
Subtopic: Manufacturing Issues and Processing
Event: 29th European Photovoltaic Solar Energy Conference and Exhibition
Session: 2BV.8.45
 
Pages:
 
1243 - 1248
ISBN: 3-936338-34-5
Paper DOI: 10.4229/EUPVSEC20142014-2BV.8.45
 
Price:
 
 
0,00 EUR
 
Document(s): paper
 

Abstract/Summary:


New photovoltaic cell concepts often involve the utilization of thin or ultra-thin silicon wafers. Future photovoltaic cells based on ultra-thin silicon wafers require an appropriate and sensitive approach for the automation of handling methods. When thinner substrates (<< 100μm) are considered, forced by cell architecture developments or new wafering technologies, new automation solutions for the cleaning of substrates may be needed. Batch processing in carriers may not work quite as well as for current wafer thicknesses (160 – 180 μm). The challenge faced with inline processing, where applicable for cleaning, is the substrate’s edge protection and continuous movement. A novel wafering method requires the cleaning of organic residues off an ultra-thin substrate in an etching bath . The paper discusses the opportunities and limits for the automated handling of single ultra-thin substrates in liquid and explains the identified significant parameters of the new handling method. The applicability and the limits of the processing parameters for underwater gripping of ultra-thin wafers as well as the opportunities for a dedicated advanced process control are presented.