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Title:
 
Accelerated Testing of Ultrasonic Welding for Crystalline Silicon on Glass Modules
 
Author(s):
 
S. Jarnason, C. Luechinger
 
Keywords:
 
c-Si, Polycrystalline, Thin Film Paste, Tabbing, Ultrasonic Welding
 
Topic:
 
Thin Films
Subtopic: Thin Film Crystalline Silicon
Event: 23rd European Photovoltaic Solar Energy Conference and Exhibition, 1-5 September 2008, Valencia, Spain
Session: 3AV.1.14
 
Pages:
 
2228 - 2231
ISBN: 3-936338-24-8
Paper DOI: 10.4229/23rdEUPVSEC2008-3AV.1.14
 
Price:
 
 
0,00 EUR
 
Document(s): paper
 

Abstract/Summary:


Ultrasonic welding has been demonstrated to be a viable alternative tabbing process to ultrasonic soldering for Crystalline Silicon on Glass (CSG) modules. Orthodyne Electronics ultrasonically welded tab ribbons to CSG test coupons to determine the influence of substrate conditions on bond quality. Substrate texture and silicon were the most important parameters to achieve reliable low contact resistivity bonds. Ultrasonically welded CSG modules were exposed to almost one and a half years of accelerated environmental exposure, demonstrating exceptional durability with minimal loss of power and minimal increase in equivalent module series resistance.