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Title:
 
Thin (90µm) Multicrystalline Si Solar Cell With 15% Efficiency by Al-Bonding to Glass
 
Author(s):
 
V. Gazuz, M. Mühlbauer, T. Kunz, R. Auer
 
Keywords:
 
Screen Printing, Bonding, RTP, Multicrystalline Solar Cells, Thin Wafer
 
Topic:
 
Wafer-Based Silicon Solar Cells and Materials Technology
Subtopic: Mono- and Multicrystalline Silicon Cells and Materials, Processing Technology of
Event: 23rd European Photovoltaic Solar Energy Conference and Exhibition, 1-5 September 2008, Valencia, Spain
Session: 2AO.3.2
 
Pages:
 
1040 - 1042
ISBN: 3-936338-24-8
Paper DOI: 10.4229/23rdEUPVSEC2008-2AO.3.2
 
Price:
 
 
0,00 EUR
 
Document(s): paper
 

Abstract/Summary:


Solar cell technologies based on silicon wafers dominate the market since the beginning of industrial production of photovoltaic modules. Future objectives are the reduction of the silicon wafer thickness and a reduction of fabrication costs. We present new results for the fabrication of solar cells according to our new concept by Albonding of silicon wafers to a supporting glass substrate. The bonding process is carried out in a Rapid Thermal Processing (RTP)-furnace and integrated in the fabrication of the pn-junction, Al-Back Surface Field (BSF) and the backside metal contact. We optimized this technology for extra thin (90 μm) multicrystalline silicon wafers, the best solar cells show an efficiency of 15%. The results of quantum efficiency and light beam inducted current (LBIC) are discussed.