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Thin (90µm) Multicrystalline Si Solar Cell With 15% Efficiency by Al-Bonding to Glass
V. Gazuz, M. Mühlbauer, T. Kunz, R. Auer
Screen Printing, Bonding, RTP, Multicrystalline Solar Cells, Thin Wafer
Wafer-Based Silicon Solar Cells and Materials Technology
Subtopic: Mono- and Multicrystalline Silicon Cells and Materials, Processing Technology of
Event: 23rd European Photovoltaic Solar Energy Conference and Exhibition, 1-5 September 2008, Valencia, Spain
Session: 2AO.3.2
1040 - 1042
ISBN: 3-936338-24-8
Paper DOI: 10.4229/23rdEUPVSEC2008-2AO.3.2
0,00 EUR
Document(s): paper


Solar cell technologies based on silicon wafers dominate the market since the beginning of industrial production of photovoltaic modules. Future objectives are the reduction of the silicon wafer thickness and a reduction of fabrication costs. We present new results for the fabrication of solar cells according to our new concept by Albonding of silicon wafers to a supporting glass substrate. The bonding process is carried out in a Rapid Thermal Processing (RTP)-furnace and integrated in the fabrication of the pn-junction, Al-Back Surface Field (BSF) and the backside metal contact. We optimized this technology for extra thin (90 μm) multicrystalline silicon wafers, the best solar cells show an efficiency of 15%. The results of quantum efficiency and light beam inducted current (LBIC) are discussed.