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Impact of Edge Deletion Techniques and Processing Parameters on Performance and Reliability of Amorphous and Microcrystalline Thin Film Photovoltaics
G. Prabhu, R. Jia, C. Luu, Y. Liu, F. Mei, M. Frei, D. Tanner
Reliability, Edge Delete, Leakage Current
Thin Films
Subtopic: Amorphous and Microcrystalline Silicon
Event: 23rd European Photovoltaic Solar Energy Conference and Exhibition, 1-5 September 2008, Valencia, Spain
Session: 3AV.2.39
2467 - 2470
ISBN: 3-936338-24-8
Paper DOI: 10.4229/23rdEUPVSEC2008-3AV.2.39
0,00 EUR
Document(s): paper


Edge Deletion is one of the critical Back End Of Line (BEOL) steps in the integration of thin film amorphous and microcrystalline silicon based photovoltaics. In this paper, we discuss studies on the impact of various edge deletion techniques and processes on both process output metrics like surface roughness, step-height, and defectivity at the edge as well as the impact of these processes on long-term panel reliability. Specifically, we use a laser based edge deletion technique as a baseline for comparison and develop an understanding of the use of alternate techniques with an emphasis on diamond wheel grinding. While correlating output metrics like surface roughness and step-height to panel performance are relatively straightforward, developing an in-depth model to understand the impact of edge surface morphology on long-term panel reliability requires sophisticated analysis. We have used standard surface characterization techniques (SEM, AFM) to get a better picture of the impact of microscopic imperfections on panel performance. We also provide a comprehensive data-set correlating performance from damp heat testing with measured edge deletion characteristics.