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Multiple Reuse of the Silicon Substrate in a Porous Silicon Based Layer Transfer Process
A. Hajijafarassar, K. Van Nieuwenhuysen, I. Sharlandzhiev, V. Depauw, H. Sivaramakrishnan Radhakrishnan, T. Bearda, M. Debucquoy, I. Gordon, J. Szlufcik, Y. Abdulraheem, J. Poortmans, L. Magagnin
Epitaxy, Porous Silicon, Recycling, Silicon (Si), Photovoltaic (PV)
Wafer-Based Silicon Solar Cells and Materials Technology
Subtopic: Silicon Feedstock, Crystallisation and Wafering
Event: 32nd European Photovoltaic Solar Energy Conference and Exhibition
Session: 2BO.2.6
313 - 316
ISBN: 3-936338-41-8
Paper DOI: 10.4229/EUPVSEC20162016-2BO.2.6
0,00 EUR
Document(s): paper


Layer transfer process based on a porous silicon template is one of the promising replacements for the conventional wafer sawing technologies. For the process to be cost-effective, one challenge is the multiple recycling of the Si substrate used as a template for epitaxial growth. The Si substrate after detachment has different types of defects. Therefore, reusing the substrate without surface reconditioning induces low detachment yields and generates low quality epitaxial Si-foils. The current work presents the first steps taken into the realization of successful substrate re-use. Firstly, possible defects and undesirable features on the surface after the detachment process are identified. Secondly, a wet-chemical reconditioning process is developed. Finally, the effectiveness of this reconditioning process is evaluated by monitoring the evolution of the foil quality through different generations. Until now, 5 generations of epitaxial foils have been demonstrated at imec.