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Characterization of a Novel Photovoltaic Backsheet Based on Polyamide-Ionomer Technology
P. Perez, D. Hari, J. Kumar, R. Nagarajan, A. Rothacker, D. Santoleri, C. Thellen
Environmental Effect, PV Materials, Stability, Backsheet, Characterisation, Characterization
New Materials and Concepts for Photovoltaic Devices
Subtopic: New Materials and Concepts for Cells and Modules
Event: 35th European Photovoltaic Solar Energy Conference and Exhibition
Session: 1CV.4.42
160 - 168
ISBN: 3-936338-50-7
Paper DOI: 10.4229/35thEUPVSEC20182018-1CV.4.42
0,00 EUR
Document(s): paper, poster


The use of low-performance, non-durable photovoltaic backsheet reduces the efficiency and safety of solar modules. These backsheets are highly susceptible to deterioration and degradation resulting from their construction. In an effort to improve the efficiency of solar energy, Tomark-Worthen has developed a novel photovoltaic backsheet known as PhotoMark® Reflections™. Produced via co-extrusion, PhotoMark® Reflections™ contains no adhesives, fluoropolymers, or poly(ethylene terephthalate) (PET). Instead, it is composed of a high performance polyamide/ionomer alloy developed to resist degradation. A comprehensive analysis of the performance of PhotoMark® Reflections™ indicates high stability of the backsheet after various accelerated aging tests, including Damp Heat, UV light exposure, and the Highly Accelerated Stress Test (HAST). Fourier- Transform-Infrared spectroscopy (FTIR) performed on PhotoMark® Reflections™ shows high resistance of the skin layers to degradation. Additionally, PhotoMark® Reflections™ and other laminate backsheets were subjected to the HAST. All laminate samples exposed to the HAST failed and delaminated prior to the 100-hour test completion time. Conversely, the PhotoMark® Reflections™ backsheet showed no inter-layer delamination after 100 hours of HAST exposure and retained its mechanical properties. The durability of PhotoMark® Reflections™ after extensive weathering indicates that the implementation of the backsheet will reduce the number of backsheet-induced module failures globally.