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Title:
 
Advanced Testing of PV Module Encapsulants
 
Author(s):
 
S. Pingel, S. Janke, B. Stannowski, S. Fechner, L. Podlowski
 
Keywords:
 
Reliability, PID, PV Module
 
Topic:
 
Photovoltaic Modules and BoS Components
Subtopic: PV Module Design, Manufacture, Performance and Reliability
Event: 35th European Photovoltaic Solar Energy Conference and Exhibition
Session: 5CV.3.38
 
Pages:
 
1346 - 1351
ISBN: 3-936338-50-7
Paper DOI: 10.4229/35thEUPVSEC20182018-5CV.3.38
 
Price:
 
 
0,00 EUR
 
Document(s): paper, poster
 

Abstract/Summary:


Encapsulation materials are of critical importance for long-term reliability and safety of PV modules. Only months in the field may lead to drastic power output degradation for example due to PID and also in the longer run adhesion and discoloration issues (Hot Spot) can reduce power output or even may lead to critical electrical safety issues. These findings are not sufficiently covered by IEC 61215 and other standard testing. Additional and different types of tests are required for an in-depth understanding of the encapsulation material’s impact on PV module performance. PI Berlin has developed a test sequence that covers many field relevant aspects for PV encapsulations. For example: i) Potential Induced Degradation (PID), ii) Hot Spot Durability and iii) High Temperature Adhesion (delamination). Additionally, material properties which impact the processability in module manufacturing are tested. Also, very new aspects like the effect of encapsulation aging on PID are evaluated.