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Title:
 
Effects of Particle Size of Aluminum Powder in Silver/Aluminum Paste on n-Type Solar Cells
 
Author(s):
 
T. Aoyama, M. Aoki, I. Sumita, A. Ogura
 
Keywords:
 
Contact, n-Type, Interface(s), Metallization, Metallisation, Screen Print
 
Topic:
 
Silicon Materials and Cells
Subtopic: Homojunction Solar Cells
Event: 36th European Photovoltaic Solar Energy Conference and Exhibition
Session: 2DV.1.14
 
Pages:
 
496 - 499
ISBN: 3-936338-60-4
Paper DOI: 10.4229/EUPVSEC20192019-2DV.1.14
 
Price:
 
 
0,00 EUR
 
Document(s): paper, poster
 

Abstract/Summary:


Aluminum-added silver paste (silver/aluminum paste) has been used as metallization for p+ emitter of n-type solar cells, because the addition of aluminum powder to the silver paste can effectively decrease contact resistance between the paste metallization and the p+ emitter. In addition, it has been reported that the contact resistance decreases with increasing the content of the aluminum powder in the paste. However, how particle size of the aluminum powder affects the contact resistance and the electrical characteristics of the n-type solar cells has not been clear yet. For this reason, in this study, the effects of the particle size of aluminum powder in the silver/aluminum paste on the contact resistance and the electrical characteristics are investigated. Our study demonstrates that the contact resistance decreases not only with increasing the content of the aluminum powder in the paste, but also with increasing the particle size of the powder. Hence, the optimization of the particle size of the aluminum powder can effectively increase fill factor of the n-type solar cells due to the decrease in the contact resistance, resulting in increasing efficiency of the solar cells.