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"Project FINALE" - Screen and Screen Printing Process Development for Ultra-Fine-Line Contacts below 20µm Finger Width
F. Clement, M. Linse, S. Tepner, N. Wengenmeyr, L. Ney, K. Krieg, A. Lorenz, M. Pospischil, S. Bechmann, K. Oehrle, S. Steckemetz, R. Preu
Printing, Si Solar Cell, Metallization, Production Technology
Silicon Materials and Cells
Subtopic: Manufacturing & Production of Si Cells
Event: 36th European Photovoltaic Solar Energy Conference and Exhibition
Session: 2DO.5.1
255 - 258
ISBN: 3-936338-60-4
Paper DOI: 10.4229/EUPVSEC20192019-2DO.5.1
0,00 EUR
Document(s): paper, presentation


Within this work, a new model of the screen printing process is set up in order to improve the understanding of the screen printing process with focus on the interaction between -paste and -screen. First results show that wall slip behavior of the paste can be significantly improved by adapting the screen chemistry, enabling a lower finger resistances and reduced finger widths. A mean contact finger width of wf = 26 µm combined with a mean finger resistance of RFinger = 99 /m shows the high potential of the newly developed screen chemistry using single-step screen printing. Screen openings of wch = 16µm and printed finger widths of wf = 17µm can be realized on textured Si wafers with ARC. Moreover, finger resistance values far below RFinger = 1000 /m are reached for nominal finger widths down to wf = 18µm. This proves the high potential of the single step screen printing process on the way to ultra-fine line contacts in combination with multi-busbar cell layouts. PERC-type Cz-Si solar cells fabricated with a 5 busbar cell layout and a nominal screen opening of wn = 24µm achieve efficiencies up to max = 22.1%. First multi-busbar solar cells with a 18µm nominal screen opening demonstrate a significant Ag reduction.