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Laser-Assisted Bonding (LAB) and Hybrid Underfill Technology for Module Fabrication Based on Silicon Back Contact Solar Cell
K.-S. Choi, J. Joo, S.H. Moon, Y.-S. Eom
Photovoltaic Modules and BoS Components
Subtopic: PV Module Design, Manufacture, Performance and Reliability
Event: 36th European Photovoltaic Solar Energy Conference and Exhibition
Session: 4AV.1.51
ISBN: 3-936338-60-4
0,00 EUR
Document(s): poster


The laser-assisted bonding process (LAB) with hybrid underfill material is proposed to accomplish the modules with a simple process, reduced bowing, and low-cost. The LAB process features the vertical thermal gradient so that the temperature of the Si solar cell maintains high but that of the substrate low. In addition, its process time is less than 10 sec. A hybrid underfill is comprised of solder power, base resins. The components of the base resin are epoxy, curing agents, reductants, and additives. During the LAB process, the interconnection and underfill process are achieved at the same time because of the distinguished properties of the hybrid underill. There is no need of the cleaning process after the interconnection process based on the LAB with hybrid underfill. With the optimizations of the process parameters, the moisture and thermal cycle reliabilities of the modules based on the LAB with hybrid underfill meet the industrial specifications.