Title:	Alternative CZ Ingot Squaring and Half-Cell Cutting Methodology for Low-Temperature PV Cell and Module Technologies
Author(s):	J.F. Lelièvre, S. Harrison, M. Albaric, L. Carton, B. Portaluppi, V. Barth
Keywords:	Czochralski (Cz), Laser Processing, Silicon, Cutting, Cleavage
Topic:	Silicon Materials and Cells
Subtopic:	Low Temperature Route for Si Cells
Event:	37th European Photovoltaic Solar Energy Conference and Exhibition
Session:	2DV.3.7
Pages:	487 - 489
ISBN:	3-936338-73-6
Paper DOI:	10.4229/EUPVSEC20202020-2DV.3.7
Price:	0,00 EUR
Document(s):	paper, poster

Abstract/Summary:

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An interdisciplinary work has been performed between three labs of CEA-LITEN, going from CZ ingot pulling to ½ cell module fabrication, and demonstrating the capability of an alternative low-temperature methodology for cutting cells in half cells (or x sub-cells for shingle module architecture) without using standard laser scribing. This simple and efficient cell cleavage technology implies minimal technological changes, making it fully compatible with the whole fabrication chain of low temperature PV cell and module technologies.