Title:	A Screening Protocol to Assess the Stability of Inks used to Mask Metallic Interconnects in BIPV Modules
Author(s):	A. Borja Block, J. Escarre Palou, A. Faes, A. Virtuani, C. Ballif
Keywords:	Reliability, Inks, Aesthetics, Metallic Interconnects, Building Integrated PV (BIPV)
Topic:	Photovoltaic Modules and BoS Components
Subtopic:	Materials for PV Modules, Durability, Reliability and Accelerated Testing Methods
Event:	8th World Conference on Photovoltaic Energy Conversion
Session:	3DV.3.15
Pages:	902 - 906
ISBN:	3-936338-86-8
Paper DOI:	10.4229/WCPEC-82022-3DV.3.15
Price:	0,00 EUR
Document(s):	paper, poster

Abstract/Summary:

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Aesthetics plays a major role in the development of BIPV products. Several BIPV module manufacturers attempt to mask the reflective metallic interconnects to obtain uniformly colored modules. This is achieved using expensive manufacturing steps, such as colored stripes with manual positioning. Inks could be an alternative to perform this process automatically. However, inks used in BIPV products must be extremely stable and do not alter their visual appearance over time. In this work, we propose a screening protocol to assess the long-term stability of seven commercial black colored inks used to mask ribbons. We apply it to coupons mimicking the structure of conventional glass/glass (G/G) and glass/backsheet (G/Bs) structures encapsulated with EVA and POE, and to one-cell modules with ink-coated ribbons with the help of an in-house developed ribbon coating equipment. The protocol includes three different test sequences. Sequence A involves 250 h of DH (85°C, 85%RH) followed by to 60 kWh/m2 of UV light exposure, sequence B the UV test only, and sequence C adhesion tests. The results show no degradation after the DH test and yellowing with unstable inks after the UV exposure. The electrical performance of modules coated with UV unstable inks, is only slightly affected (~-1%).