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Study of the Edge and Surface Cracks Influence in the Mechanical Strength of Silicon Wafers
J. Barredo Egusquiza, L. Hermanns, A. Fraile, J.C. Jimeno, E. Alarcón
Cost Reduction, Defects, Characterisation, Characterization
Wafer-based Silicon Solar Cells and Materials Technology
Subtopic: Mono- and Multicrystalline Silicon Materials and Cells
Event: 24th European Photovoltaic Solar Energy Conference, 21-25 September 2009, Hamburg, Germany
Session: 2DV.1.35
2116 - 2119
ISBN: 3-936338-25-6
Paper DOI: 10.4229/24thEUPVSEC2009-2DV.1.35
0,00 EUR
Document(s): paper


The objective of the present study is the estimation of the depth to which the wire sawing process causes damage to the wafer surfaces. Previous analyses were carried out by means of the four line bending test. The characteristic of this test implied that the failure could be due to surface cracks located in the central zone of the wafer or near the edges. In order to evaluate the influence of the edge or surface cracks a new study has been carried out using the ball/ring on ring test. Description and results of the tests are presented. The preliminary analysis of the failure stress using analytical methods confirms the expected results. A Finite Element model developed to get more information of the test results is also presented.