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Characterization of the Damaging Potential of High Throughput Cell Manufacturing Processes by Sensitive Strength Analysis
R. Koepge, S. Grosser
Reliability, Manufacturing, Automation, Mechanical Strength, Defect
Silicon Materials and Cells
Subtopic: Manufacturing & Production of Si Cells
Event: 8th World Conference on Photovoltaic Energy Conversion
Session: 1DV.4.29
187 - 190
ISBN: 3-936338-86-8
Paper DOI: 10.4229/WCPEC-82022-1DV.4.29
0,00 EUR
Document(s): paper


Current motion and process sequences already lead to breakage in cell and module manufacturing under industry standard wafer cycle times. Increasing wafer throughput can lead to extreme handling challenges if the wafer needs to survive cell production undamaged. This investigation shows a method to analyze cell manufacturing processes regarding wafer damaging. A prototype handling process was developed, and damage was measured indirectly by the wafer strength. The statistical strength distributions of wafers are compared. The introduced procedure for wafer strength analysis was applied for the first time to evaluate high throughput manufacturing processes. Two handling operations modes, that means printing processes are compared to each other regarding the fracture stress distribution. The results show a decrease of wafer strength after handling by novel printing technologies. The rotary printing process and screen-printing was performed. Strength reduction was observed.