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Title:
 
Assessment of Interconnection Aging in Shingled Cell Modules
 
Author(s):
 
S. Grosser, M. Schak, M. Pander, M. Turek, B. Jäckel
 
Keywords:
 
Stability, Magnetic Field, Interconnection, Shingle, Characterisation
 
Topic:
 
Photovoltaic Modules and BoS Components
Subtopic: Materials for PV Modules, Durability, Reliability and Accelerated Testing Methods
Event: 8th World Conference on Photovoltaic Energy Conversion
Session: 3DV.3.18
 
Pages:
 
912 - 916
ISBN: 3-936338-86-8
Paper DOI: 10.4229/WCPEC-82022-3DV.3.18
 
Price:
 
 
0,00 EUR
 
Document(s): paper
 

Abstract/Summary:


Shingled solar cells with Electrically Conductive Adhesive (ECA) interconnection represent a technological path to make very esthetic and efficient modules with lead free interconnection technology. The reliability assessment of the interconnection stability in shingled modules is one major aspect in the material qualification for selection of proper ECAs and process requirements. For shingle technology, commonly used electroluminescence (EL) image interpretation for string or module inspection gets more complex due to the lack of simple fingerprint-like clear features. The aim of this work is the evaluation of non-destructive proof, localization, and quantification of ECA failures in shingled solar cell modules. The Magnetic Field Imaging (MFI) technique has been applied to specifically detect defects in the interconnection. A simplified visualization scheme has been developed and successfully tested. A comparison between stressed shingled strings and their initial data allows the quantitative assessment of mechanical stress-related (bending and cycling) ECA-interconnection failures, their lateral distribution und occurrence frequency. With the application of the MFI-based imaging technique, it is feasible to detect and assess aged ECA interconnections as well as identify string-dependent inhomogeneities in aging. The applicability of the MFI-based approach has been successfully demonstrated and extends EL characterization with specific sensitivity to interconnection reliability assessment.